TSMC, PSC, VIS to Build Five 12-inch Wafer Plants in Taiwan
March 14, 2008
Taiwan's TSMC, along with two other Taiwanese chip makers PSC (Powerchip Semiconductor Corp) and VIS (Vanguard International Semiconductor), have jointly begun construction on a new semiconductor manufacturing and R&D complex in the Hsinchu Science Park in northern Taiwan, according to Taiwan's Economic Daily News. Overall, five new wafer plants will be set up in this complex, with a total investment of up to NT$600 billion (US$19.6 billion; US$1=NT$30.6).
One of TSMC's two new wafer plants will be the company's first R&D plant, and the company plans to invest US$5 billion in the R&D of 32nm, 22nm, and 15nm process technologies. The said plant is projected to employ about 3,000 R&D personnel, according to Economic Daily News citing TSMC CEO.
PSC plans to build its fourth and fifth 12-inch wafer plants, which will be named P4 and P5, respectively. Construction on P4 is slated for completion by 2009, and maximum monthly capacity is estimated at 60,000 units. VIS will also have its own first 12-inch wafer plant in the complex.